Global Wood Packaging Forum Meets During Interpal 2023 in Montreal

Members of the Global Wood Packaging Forum gathered together for an in-person meeting during the renowned Interpal 2023 event in Montreal. This significant convergence saw 22 distinguished participants from a diverse range of countries, marking a momentous occasion for the industry.

After four years of prolonged period of virtual interactions, this year’s face-to-face assembly underscored the industry’s commitment to innovation, collaboration, and sustainable progress. The event provided an invaluable platform for these experts to exchange insights, discuss challenges, and set the roadmap for the future of wood packaging.

The meeting emphasized the importance of the wood packaging industry in supporting global commerce and its unique challenges, from sustainability concerns to technological advancements. It also fostered international collaboration, laying the foundation for future partnerships and innovations.

Interpal 2023 and the Global Wood Packaging Forum continue their commitment to furthering the industry, offering expert knowledge, tools, and resources. This year’s in-person meeting was not only a testament to the resilience of the community but also a beacon of hope for brighter days ahead for global trade and collaboration.